教学、科研项目: 1.指导大学生创新创业训练项目:节银环保铜基电接触材料的设计与优化 国家级 2020.6-2021.7; 2.主持横向课题:均温板毛细芯烧结与测试(HG21H246), 2021.4-2021.8; 3.参与国家自然科学基金: TCO/Cu界面的润湿性及其对铜基电接触材料致密化及性能的影响; 4.参与国家电网公司科技项目:石墨烯改性铜基复合材料制备工艺研究;
代表著作、论文、专利: 1. Wei-Jian Li, Zi-Yao Chen, Hao Jiang, Xiao-Han Sui, Cong-Fei Zhao, Liang Zhen, Wen-Zhu Shao*. Effects of interfacial wettability on arc erosion behavior of Zn2SnO4/Cu electrical contacts. Journal of Materials Science and Technology, 2022, 109: 64-75. 2. Jing Yu, Wei-Jian Li, Guibo Kao, Cheng-Yan Xu*, Rongrong Chen, Qi Liu, Jingyuan Liu, Hongsen Zhang, Jun Wang*. In-situ growth of CNTs encapsulating P-doped NiSe2 nanoparticles on carbon framework as efficient bifunctional electrocatalyst for overall water splitting. Journal of Energy Chemistry, 2021, 60: 111-120. 3. Yufan Peng, Rui Zhang, Binbin Fan, Weijian Li, Zhen Chen, Hui Liu, Peng Gao, Shibing Ni, Jilei Liu*, Xiaohua Chen*. Optimized kinetics match and charge balance toward potassium ion hybrid capacitors with ultrahigh energy and power densities. Small, 2020, 16: 2003724. 4. Zhaohua Miao, Doudou Huang, Yichuan Wang, Wei-Jian Li*, Linxin Fan, Jingguo Wang, Yan Ma, Qingliang Zhao,* Zhengbao Zha*. Safe-by-design exfoliation of niobium diselenide atomic Crystals as a theory-oriented 2D nanoagent from anti-inflammation to antitumor. Advanced Functional Materials, 2020, 30: 2001593. 5. 晁代义, 孙友政, 刘晓滕, 李兴东, 李维建, 吕正风, 程仁策. Zn/Mg比及时效温度对Al-Zn-Mg-Cu系合金析出行为的影响. 《材料导报》, 2019, 33: 398-401. 6. Shuai Qi, Dong Wang*, Weijian Li, Rui Zhang, Feng Liu, Junting Zhang, Zhiyuan Liu, Yana Guo, Fagang Wang*, Guangwu Wen*. Mass production of nitrogen and oxygen codoped carbon nanotubes by a delicately-designed Pechini method for supercapacitors and electrocatalysis. Nanoscale, 2019, 11: 17425. 7. 丁一, 祝志祥, 邵文柱, 李维建, 许红阳, 陈保安, 张强, 韩钰, 陈新, 王强. La元素对ATO/Cu电接触材料润湿性及组织性能的影响. 《功能材料》, 2019, 10: 10104-10109. 8. Jing Yu#, Wei-Jian Li#, Hongsen Zhang, Fei Zhou, Rumin Li, Cheng-Yan Xu*,Limin Zhou, Hang Zhong, Jun Wang*. Metallic FePSe3 nanoparticles anchored on N-doped carbon framework for All-pH hydrogen evolution reaction, Nano Energy, 2019, 57: 222-229. 9. Wei-Jian Li, Wen-Zhu Shao*, Qing Chen, Sui-Xiao Han, Yu Han, Bao-An Chen, Qiang Wang, Liang Zhen. Adhesion and electronic structures of Cu/Zn2SnO4 interfaces: A first-principles study, Journal of Applied Physics, 2019, 125: 225303. 10. Wei-Jian Li, Wen-Zhu Shao*, Qing Chen, Lu Zhang, Yu Han, Bao-An Chen, Qiang Wang, Liang Zhen. Effects of dopants on the adhesion and electronic structure of a SnO2/Cu interface: a first-principles study, Physical Chemistry Chemical Physics, 2018, 20: 15618-15625. 11. Wei-Jian Li, Wen-Zhu Shao*, Niang Xie, Lu Zhang, Yuan-Ru Li, Meng-Shi Yang, Bao-An Chen, Qiang Zhang, Qiang Wang, Liang Zhen. Air arc erosion behavior of CuZr/Zn2SnO4 electrical contact materials, Journal of Alloys and Compounds, 2018, 743: 697-706.
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